Technical specifications
Certifications
| ISO 9001:2015 | Yes |
| IATF 16949 | Yes |
| ISO 14001 | Yes |
| Reach + RoHS compliant | Yes |
| Others | Yes |
Surfaces
| HAL-leadfree | 3 – 25 µm |
| Immersion tin | 0,80 – 1,20 µm |
| Immersion silver | 0,12 – 0,38 µm |
| ENIG (immersion gold) | Ni:2 – 3,75 µm, Au:0,05 – 1,20 µm |
| OSP | <1 µm |
| Electrolytic hard gold (Au thickness)/gold fingers | 0,025 – 1,27 µm |
| Electrolytic soft gold (Au thickness) | 0,025 – 1,20 µm |
| Electrolytic gold for wire bond | 0,38 – 0,75 µm |
| Selective finishes (more than one finish) | ENIG / OSP / imm. silver / HAL-LF + gold fingers |
Copper Thickness
| 18 – 210 µm (35µm, 70µm Standard) | Yes |
Layers & Board Thickness
| Single sided | 0,4 – 8,0 mm |
| Double sided | 0,4 – 8,0 mm |
| Multilayer | 0,4 – 6,0 mm |
| 4 – 6 layers | 0,4 – 6,0 mm |
| 8 –12 layers | 1,0 – 6,0 mm |
| over 12 layers | 1,4 – 6,0 mm |
| Max layers count flex | 8 |
| Max layers count rigid-flex | 12 |
Materialtypes
| FR-4 | Yes |
| Flex | Yes |
| Rigid-Flex | Yes |
| Teflon | F4B, Rogers, Taconic, Arlon |
| Ceramic | Rogers |
| Polyimide | Yes |
| Hybrid | Rogers+FR-4, PTFE+FR-4 |
| Aluminum (IMS) | Bergquist & others |
Minimum line width and spacing
| 3mil | Yes |
Minimum Hole Size
| Laser drilling | 4 mil |
| CNC drilling | 8 mil |
Minimum Tolerances
| Plated-through holes | +/-0,05 mm |
| NPTH | +/-0,05 mm |
| Outline-routed | +/-0,10 mm |
| Outline-scored | +/-0,15 mm |
Scoring
| 20°, 30°, 45°, 60° | Yes |
| Jump-scoring | Yes |
Colors
| Soldermask | green, black, white, blue, yellow, red |
| Silkscreen | white, yellow |
Additional Process Capabilities
| Peelable Mask | Yes |
| Max. diameter to tent with peelable mask | 2,50 mm |
| Max. peelable mask thickness | 0,40 mm |
| Via hole filler soldermask (100% fill) | Yes |
| Via hole filler soldermask max. hole diameter | 0,60 mm |
| Conductive hole filler (silver/copper) | Yes |
| Carbon ink min. spacing | 0,15 mm |
| Half-hole plating | Yes |
| Edge plating | Yes |
| Min. hole wall plating thickness | 25 µm |
| Countersinks | 90° |
| Bevelling | 20°, 30°, 45°, 60° |
| Controlled depth routing | Yes |
| Blind vias | Yes |
| Buried vias | Yes |
| Via in pad technology | Yes |
| Controlled impedance | Yes |
| PCB length | ≤ 1200mm |
